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Circuit design challenges at the 14nm technology node

机译:14nm技术节点的电路设计挑战

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Technology scaling non-idealities, already apparent in the transitions between previous technology generations, will become even more pronounced as the world moves from the 22nm node to the 14nm node. Digital logic designers working on high-performance microprocessors and similar projects will face significant new challenges as the basic FET structure is changed in a fundamental way, in order to squeeze more performance from scaled devices. New design constraints and new sources of variability will have to be understood, and new methodologies will be required to enable robust, high-speed designs. In addition, the metal interconnects between devices will also be stressed. Scaled wire RC will likely increase, and new tools and methods will be needed to ensure reliable designs.
机译:随着世界从22nm节点向14nm节点的转变,在前几代技术之间的过渡中已经显而易见的技术扩展非理想性将变得更加明显。由于从根本上改变了基本的FET结构,以便从规模化的设备中获得更高的性能,从事高性能微处理器和类似项目的数字逻辑设计人员将面临严峻的新挑战。必须理解新的设计约束和新的可变性来源,并且需要新的方法来实现可靠的高速设计。此外,器件之间的金属互连也会受到压力。缩放的线控RC可能会增加,并且需要新的工具和方法来确保可靠的设计。

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