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首页> 外文期刊>International journal of electronics >Analysis of 14nm technology node In_(0.53)Ga_(0.47)As nFinFET integrated with In_(0.53)Al_(0.48)As cap layer for high-speed circuits
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Analysis of 14nm technology node In_(0.53)Ga_(0.47)As nFinFET integrated with In_(0.53)Al_(0.48)As cap layer for high-speed circuits

机译:与In_(0.53)Al_(0.48)As盖层集成的14nm工艺节点In_(0.53)Ga_(0.47)As nFinFET的分析

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CMOS (Complementary Metal-oxide-semiconductor) based high-speed applications in the sub-14 nm technology node using InGaAs Fin field-effect-transistors (FinFETs) confront with inevitable effect in form of interface traps upon integration of dielectric layer with InGaAs material. In this work, we have explored the impact of the traps on short channel effects (SCEs) and a technique of abating the effect of interface traps by introducing In(0.52)Al0.As-48 cap layer. Proposed work reforms the device by varying the cap layer thickness (Tcap), doping concentrations of cap layer and underlap region. The effect of traps on intrinsic delay, work function variation and SCEs was investigated to assess the trend on devices with In0.52Al0.48As cap layer. It has been observed that introduction of Tcap improves SCEs and helps to mitigate the effect of interface traps. SCEs can be additionally diminished by presenting underlap fin length at the cost of higher delay. The experimental results show the value of subthreshold swing = 149.54 mV/decade, drain-induced barrier lowering = 38.5 mV V-1 and delay = 1.1 ps for T-cap = 4 nm without underlap fin length structure for traps concentration of 10(12) cm(-2)eV(-1). Thus, significant improvement has been seen in SCEs and delay performance in FinFET structure with cap layer.
机译:使用InGaAs鳍式场效应晶体管(FinFET)在14纳米以下技术节点中基于CMOS(互补金属氧化物半导体)的高速应用在介电层与InGaAs材料集成时以界面陷阱的形式面临不可避免的影响。在这项工作中,我们探索了陷阱对短沟道效应(SCE)的影响,以及通过引入In(0.52)Al0.As-48盖层来减轻界面陷阱效应的技术。拟议的工作通过改变盖层厚度(Tcap),盖层的掺杂浓度和重叠区域来对器件进行改造。研究了陷阱对固有延迟,功函数变化和SCE的影响,以评估具有In0.52Al0.48As盖层的器件的趋势。已经观察到,引入Tcap可改善SCE,并有助于减轻界面陷阱的影响。 SCE可以通过增加重叠鳍的长度来减少,以增加延迟为代价。实验结果表明,对于T型电容= 4 nm,无阈值摆幅的亚阈值摆幅值= 149.54 mV / decade,漏极引起的势垒降低= 38.5 mV V-1和延迟= 1.1 ps对于陷阱浓度为10(12)的情况)cm(-2)eV(-1)。因此,在具有盖层的FinFET结构中,SCE和延迟性能已得到显着改善。

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