首页> 外文会议>IEEE European Test Symposium >A 3DIC interconnect interface test and repair scheme based on Hybrid IEEE1838 Die Wrapper Register and BIST circuit
【24h】

A 3DIC interconnect interface test and repair scheme based on Hybrid IEEE1838 Die Wrapper Register and BIST circuit

机译:基于混合IEE1838模包装寄存器和BIST电路的3DIC互连接口测试和修复方案

获取原文

摘要

This paper proposes a test and repair scheme for 3DICs based on Hybrid IEEE1838 Die Wrapper Register(DWR) and Build In Self-Test(BIST) circuit, The fault location of interconnect interface is pointed out by BIST circuit automatically, and the repair is completed by Build In Self-Repair(BISR) circuit automatically. At the same time, DWR structure is designed to support combinational circuit around the interconnect interface, which can ensure the overall test coverage.
机译:本文提出了基于混合IEE1838模具包装寄存器(DWR)的3DICS的测试和修复方案,并在自检(BIST)电路中,互连接口的故障定位由BIST电路自动指出,修复完成 通过自动构建自修复(BISR)电路。 与此同时,DWR结构旨在支持互连接口周围的组合电路,可以确保整体测试覆盖范围。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号