The Technology of Flip Chip Bonding on an Organic Substrate for PDA

摘要

We developed and commercialized a wristwatch PDA that is highly portable and convenient. In order to make this PDA compact and lightweight, we developed flip chip bonding technology that will mount multiple LSIs on either side of an organic build up wiring PCB. We used anisotropic conductive film (ACF) to achieve a minimum electrode pitch of 100 μm in flip chip bonding, and introduced thermal stress simulations as well as the Taguchi method in order to achieve superior mass production quality and high reliability.