Method of mounting semiconductor chip on substrate using flip chip bonding technology

摘要

The method involves melting a soldering material on an assembling region of a semiconductor chip (5) by a soldering process such that the assembling region moves towards a substrate (10) due to the surface tension of the melted material. A component region of the chip is lifted from the substrate during the process such that the region indirectly contacts the substrate via the soldering material and the chip is assembled on the substrate by the Flip-chip technique. A supporting socket in the component region contacts either the substrate after the chip is assembled. An independent claim is also included for a semiconductor chip assembled on a substrate by a flip-chip technique.