METHOD FOR BONDING FLIP CHIPS CAPABLE OF BONDING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR SUBSTRATE BY USING SOLDER BALL MOUNTING TECHNIQUE

摘要

PURPOSE: A method for bonding flip chips is provided to reduce process costs and process time in flip chip bonding by omitting a coating process, a thermal process, an exposure process, a photolithography process, and a cleaning process which are required for solder resist.;CONSTITUTION: A semiconductor device(110) includes a plurality of first electrode pads(123) and a plurality of second electrode pads(121). The semiconductor device includes two first areas(A) and a second area(B) located between the two first areas. The plurality of first electrode pads is arranged while being separated on the first area. The plurality of second electrode pads is arranged while being separated on the second area. The plurality of second electrode pads is electrically connected through a conductive line(122).;COPYRIGHT KIPO 2012