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A new optimized process for low pressure nitridation of thin thermal gate oxide

机译:薄热栅氧化物的低压氮化新工艺

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In this paper, a new process is proposed for low pressure nitridation of thin thermal gate oxide (8 nm) that does not produce interface degradation as it is generally observed by conventional NH3 nitridation. Electrical characteristics of thin oxides nitrided in NH3 from 1/2-h to 3-h at 5 torr and 900°C have been studied. Fixed positive charge and interface state densities in the 1010 cm-2 range have been measured. Remarkable improvements of the interface state generation and charge trapping have been obtained after a 1/2-h nitridation, without using any reoxidation step. Under this condition, Qbd values are superior or comparable to those classically obtained on such very thin oxide.
机译:在本文中,提出了一种新的方法来进行薄热栅氧化物(8 nm)的低压氮化,该工艺不会产生界面降解,这是常规NH 3 氮化通常会观察到的。研究了在5torr和900°C下在NH 3 中从1 / 2-h到3-h氮化的薄氧化物的电学特性。已测量了10 10 cm -2 范围内的固定正电荷和界面态密度。氮化1/2小时后,无需使用任何再氧化步骤,即可显着改善界面态的产生和电荷俘获。在这种条件下,Qbd值优于或可比于在这种非常薄的氧化物上经典获得的值。

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