Abstract: Complex relief-type resist surfaces are of increasinginterest for applications in optical and photonicdevices. They can be fabricated by using direct writeelectron beam lithography. The crucial point in thefabrication of such reliefs is the inexact approach tothe desired resist profile and the increased roughnessof the resist surface. This work focusses on threeimportant steps towards a better realization of smoothprofiles, i.e. an improvement in beam positionaccuracy, a reduction of exposure errors caused by theinsufficiency of the conversion software and asmoothing technique applied after development. Theintroduced techniques are expected to considerablyimprove the functionality of relief type devices.!4
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