Modeling of Hierarchical Power/Ground Network based on Segmentation Method for Package/Board Co-Design and Simulation

摘要

Hierarchical power/ground network is the most common structure in system, however it is hard to extract the impedance property of it, because of the interaction between structures in system, such as package and board. With resonant cavity model, segmentation method and two proposed issues on hierarchical network, we can find out the total impedance of system. The result has been verified by comparing with the result of 3D full wave simulation in frequency domain.