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Electromagnetic modeling and signal integrity simulation of power/ground networks in high speed digital packages and printed circuit boards

机译：高速数字封装和印刷电路板中电源/接地网络的电磁建模和信号完整性仿真

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Frank Y. Yuan;
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年度 1998
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1. Signal Integrity Analysis of the Traces in Electromagnetic-Bandgap Structure in High-Speed Printed Circuit Boards and Packages [J] . Zhang M.-S., Li Y.-S., Jia C., IEEE Transactions on Microwave Theory and Techniques . 2007,第5期

机译：高速印刷电路板和封装中电磁带隙结构中的迹线的信号完整性分析
2. Signal and Power Integrity Analysis of Differential Lines in Multilayer Printed Circuit Boards With Embedded Electromagnetic Bandgap Structures [J] . Electromagnetic Compatibility, IEEE Transactions on . 2010,第2期

机译：具有嵌入式电磁带隙结构的多层印刷电路板中差分线的信号和功率完整性分析
3. Analysis of Noise Coupling From a Power Distribution Network to Signal Traces in High-Speed Multilayer Printed Circuit Boards [J] . Jingook Kim, Mihai D. Rotaru, Seungyong Baek, IEEE Transactions on Electromagnetic Compatibility . 2006,第2期

机译：高速多层印刷电路板中从配电网络到信号走线的噪声耦合分析
4. Electromagnetic modeling and signal integrity simulation of power/ground networks in high speed digital packages and printed circuit boards [C] . Yuan F.Y. Numerical Simulation of Optoelectronic Devices, 2004. NUSOD '04 . 2004

机译：高速数字封装和印刷电路板中电源/接地网络的电磁建模和信号完整性仿真
5. Printed circuit board power distribution network modeling, analysis and design, and, statistical crosstalk analysis for high speed digital links [D] . Shringarpure, Ketan 2015

机译：印刷电路板配电网络建模，分析和设计，以及高速数字链路的统计串扰分析
6. Direct-referencing Two-dimensional-array Digital Microfluidics Using Multi-layer Printed Circuit Board [O] . Jian Gong, Chang-Jin CJ Kim -1

机译：使用多层印刷电路板的直接参照二维阵列数字微流控技术
7. Analysis of noise coupling from a power distribution network to signal traces in high-speed multilayer printed circuit boards [O] . Kim, Jingook, Rotaru, Mihai D., Baek, Seungyong, 2014

机译：分析配电网络与高速多层印刷电路板中信号走线的噪声耦合

Electromagnetic modeling and signal integrity simulation of power/ground networks in high speed digital packages and printed circuit boards

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