Machine-Vision-Based Measurement of BGA Connector Solder Balls

摘要

This article presents the principle and application of a machine-vision-based method of measuring the quality of solder balls on BGA devices. The method first acquires two images of a BGA connector respectively with the same light source but different light angles, obtains from the two images the information on surfaces of solder balls and calculates the chief quality parameters of the solder balls in the end. The main algorithm measuring the solder balls is given in the article.