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Intrinsic Stress of DLC Film Prepared by RF Plasma CVD and Filteredcathodic ARC PVD

机译:RF等离子体CVD和阴极ARC PVD制备DLC薄膜的本征应力。

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Summary form only given. Diamond-like carbon (DLC) films frequently exhibit poor adhesion strength and delaminate instantly due to high internal compressive stress , as high as 8.5 GPa generated in the film, thus resulting in the limitation of the film. Our recent experimental results suggest a functional relationship between the intrinsic compressive stress and the negative biasing voltage applied to the substrate. For the first time, we have obtained DLC compressive stress data as a function of DC bias voltage for films prepared from the C2H2 RF plasma and we compare them with data obtained from the cathodic arc. Although the deposition rate was different, the DLC deposition rate of the filtered cathodic arc being ~1 nm per sec. while the rate in the RF process is approximately 2 nm per min., a similar trend in the stress generation and the stress-relief region was observed in both methods of deposition. The motivation for this study was to establish a coating methodology for DLC that yields a high sp3:sp2 ratio and strong adhesion strength. Such a coating is expected to be hard but not easily delaminated, and would be useful when coated on to steel substrates such as industrial cutting tools, to enhance life performance and cost savings. The preliminary results showed that a thicker DLC film can be obtained by incorporating a lower stress, graphitic layer or a silicon layer.
机译:仅提供摘要表格。类金刚石碳(DLC)膜经常会表现出较差的粘合强度,并且由于高内部压缩应力(在膜中产生高达8.5 GPa的压力)而立即脱层,从而导致了膜的局限性。我们最近的实验结果表明,固有压缩应力与施加到基板上的负偏置电压之间存在函数关系。我们首次获得了由C 2 H 2 RF等离子体制备的薄膜的DLC压缩应力数据与DC偏置电压的函数关系,并将它们与数据进行比较从阴极弧获得。尽管沉积速率不同,但过滤后的阴极电弧的DLC沉积速率约为1 nm /秒。虽然射频工艺的速率约为每分钟2 nm,但在两种沉积方法中都观察到了类似的应力产生趋势和应力释放区域。这项研究的动机是建立一种DLC涂层方法,该方法可产生高sp 3 :sp 2 比率和强粘合强度。期望这样的涂层坚硬但不容易分层,并且当涂覆到诸如工业切削工具的钢基底上时将是有用的,以提高寿命性能和节省成本。初步结果表明,通过掺入较低应力的石墨层或硅层可以获得较厚的DLC膜。

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