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Erbium-Doped Amorphous Carbon-Based Thin Films: A Photonic Material Prepared by Low-Temperature RF-PEMOCVD

机译:掺b非晶碳基薄膜:通过低温RF-PEMOCVD制备的光子材料

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摘要

The integration of photonic materials into CMOS processing involves the use of new materials. A simple one-step metal-organic radio frequency plasma enhanced chemical vapor deposition system (RF-PEMOCVD) was deployed to grow erbium-doped amorphous carbon thin films (a-C:(Er)) on Si substrates at low temperatures (<200 °C). A partially fluorinated metal-organic compound, tris(6,6,7,7,8,8,8-heptafluoro-2,2-dimethyl-3,5-octanedionate) Erbium(+III) or abbreviated Er(fod)3, was incorporated in situ into a-C based host. Six-fold enhancement of Er room-temperature photoluminescence at 1.54 μm was demonstrated by deuteration of the a-C host. Furthermore, the effect of RF power and substrate temperature on the photoluminescence of a-C:D(Er) films was investigated and analyzed in terms of the film structure. Photoluminescence signal increases with increasing RF power, which is the result of an increase in [O]/[Er] ratio and the respective erbium-oxygen coordination number. Moreover, photoluminescence intensity decreases with increasing substrate temperature, which is attributed to an increased desorption rate or a lower sticking coefficient of the fluorinated fragments during film growth and hence [Er] decreases. In addition, it is observed that Er concentration quenching begins at ~2.2 at% and continues to increase until 5.5 at% in the studied a-C:D(Er) matrix. This technique provides the capability of doping Er in a vertically uniform profile.
机译:将光子材料集成到CMOS处理中涉及使用新材料。部署了一个简单的一步金属有机射频等离子体增强化学气相沉积系统(RF-PEMOCVD),以在低温(<200°C)的Si衬底上生长掺-的非晶碳薄膜(aC:(Er))。 )。部分氟化的金属有机化合物,三(6,6,7,7,8,8,8,8-七氟-2,2-二甲基-3,5-辛二酸酯)ate(+ III)或简称Er(fod)3 ,被原位整合到基于aC的宿主中。通过a-C主体的氘化证明1.54μm的Er室温光致发光增强了六倍。此外,研究了射频功率和衬底温度对a-C:D(Er)薄膜光致发光的影响,并根据薄膜结构进行了分析。光致发光信号随RF功率的增加而增加,这是[O] / [Er]比和相应的-氧配位数增加的结果。此外,光致发光强度随着基板温度的升高而降低,这归因于膜生长过程中氟化片段的解吸速率提高或粘附系数降低,因此[Er]降低。另外,观察到在研究的α-C:D(Er)基质中,Er浓度猝灭从〜2.2 at%开始,并持续增加直至5.5 at%。该技术提供了以垂直均匀的轮廓掺杂Er的能力。

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