Electrical integrity of state-of-the-art 0.13 /spl mu/m SOI CMOS devices and circuits transferred for three-dimensional (3D) integrated circuit (IC) fabrication

摘要

We introduce a new scheme for building three-dimensional (3D) integrated circuits (ICs) based on the layer transfer of completed devices. We demonstrate for the first time that the processes required for stacking active device layers preserve the intrinsic electrical characteristics of state-of-the-art short-channel MOSFETs and ring oscillator circuits, which is critical to the success of high performance 3D ICs.