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Mechanism of the suppression of the floating-body effect for SOI MOSFETs with SiGe source structure

机译:具有SiGe源极结构的SOI MOSFET的浮体效应抑制机理

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SiGe layers were formed in source regions of partially depleted 0.25 /spl mu/m SOI nMOSFETs with the Ge implantation technique and the floating-body effect was investigated for the SiGe source structure. It was confirmed that kinks in the Id-Vd characteristics and the anomalous lowering of the subthreshold swing were suppressed and that the drain breakdown voltage increased for this structure. The mechanism of this suppression effect is presented for the first time. It is found that this suppression originates from the decrease in the current gain for source/channel/drain lateral bipolar transistors with the SiGe source structure. The temperature dependence of the base current indicates that the bandgap narrowing in the source region is the major reason for the decrease in the current gain.
机译:利用锗注入技术在部分耗尽的0.25 / spl mu / m SOI nMOSFET的源区中形成了SiGe层,并研究了SiGe源结构的浮体效应。可以确认,Id-Vd特性的扭结和亚阈值摆幅的异常降低被抑制,并且该结构的漏极击穿电压增加。首次介绍了这种抑制作用的机理。发现这种抑制源自具有SiGe源极结构的源极/沟道/漏极横向双极型晶体管的电流增益的减小。基本电流的温度依赖性表明,源极区域的带隙变窄是电流增益降低的主要原因。

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