首页> 外文期刊>IEEE Transactions on Electron Devices >Suppression of the floating-body effect in SOI MOSFET's by the bandgap engineering method using a Si/sub 1-x/Ge/sub x/ source structure
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Suppression of the floating-body effect in SOI MOSFET's by the bandgap engineering method using a Si/sub 1-x/Ge/sub x/ source structure

机译:使用Si / sub 1-x / Ge / sub x /源结构的带隙工程方法抑制SOI MOSFET中的浮体效应

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摘要

The bandgap engineering method using a SiGe source structure is presented as a means to suppress the floating-body effect in SOI MOSFET's. Experiments using Ge implantation are carried out to form a narrow-bandgapped SiGe layer in the source region. It has been confirmed that Ge-implanted SIMOX exhibited a 0.1 eV bandgap narrowing with a relatively low Ge-dosage of 10/sup 16/ cm/sup -2/. The fabricated N-type SOI-MOSFET's exhibited suppressed parasitic bipolar effects, such as improvement of the drain breakdown voltage or latch voltage, and suppression of abnormal subthreshold slope. Advantages over other conventional methods are also discussed, indicating that the bandgap engineering provides a practical method to suppress the floating-body effect.
机译:提出了一种使用SiGe源极结构的带隙工程方法,以抑制SOI MOSFET中的浮体效应。进行了使用Ge注入的实验,以在源区中形成窄带隙的SiGe层。已经证实,注入Ge的SIMOX表现出0.1eV的带隙变窄,相对较低的Ge剂量为10 / sup 16 / cm / sup -2 /。制成的N型SOI-MOSFET表现出抑制的寄生双极效应,例如改善了漏极击穿电压或闩锁电压,并抑制了异常的亚阈值斜率。还讨论了与其他常规方法相比的优点,这表明带隙工程提供了一种抑制浮体效应的实用方法。

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