Resonant tunneling in InP/InGaAs lateral double barrier heterostructures

摘要

Continued down-scaling of electron devices in integrated circuits in order to achieve higher density eventually results in electron devices in which quantum effects play a significant role. These quantum effects can be exploited and used to increase the functionality of electronic devices and circuits resulting in high-density (multi-valued) logic and memory functions. The lateral resonant tunneling diode and transistor are two quantum effect devices that are well suited for this task and are also ideal for planar integration. A planar lateral double barrier heterostructure is demonstrated here for the first time. Resonances in the I-V characteristics are observed that have peak to valley current ratios as high as 3.5 at 4.2 K and are attributed to resonant tunneling in a 2D/1D/2D system. The InP substrate based device structure consists of an InP/lnGaAs/InP MODFET structure within which a lateral double barrier heterostructure, consisting of InP barriers and InGaAs well and contacts, has been integrated by etch and regrowth techniques. This demonstration opens the way for the fabrication of the lateral resonant tunneling transistor.