Subminiature silicon integrated electret condenser microphone

摘要

Summary form only given. The authors have developed microphones which use one silicon wafer to support a thin polyester diaphragm and a second to carry a Teflon electret. Subassemblies are diced from the wafer and bonded together to form complete microphones. The preamplifier circuit can be carried on either subassembly. Microphones with reasonable signal-to-noise ratio can be obtained with edge dimensions of 3 mm or less.