Low temperature bonding process using mixed Cu-Ag nanoparticles for electronic packaging

摘要

The lead and its compounds can bring harm to natural resources and human health. It isrnnecessary to develop new bonding method using Pb-free material as an alternative to Pb-bearrnsolder for microelectronic packaging. During the past few years, much attention has beenrnpaid to low temperature bonding technology using Ag nanoparticles (Ag NPs). However,rnpackaged joints with Ag NPs are accompanied with some disadvantages such as high cost,rnhigh ionic migration. In this study to overcome the mentioned problems, we investigate a newrnlow temperature sintering-bonding technique utilizing mixed Cu-Ag nanoparticles (Cu-AgrnNPs) as bonding materials. The Cu nanoparticles (Cu NPs) and Ag nanoparticles (Ag NPs)rnwere prepared by chemical reduction method respectively. The Cu-Ag NPs were prepared byrnmixing Cu NPs and Ag NPs. Our experiment showed that strong joints were obtained usingrnCu-Ag nanopaste at 200 ℃ in air atmosphere. This novel sintering-bonding technology usingrnCu-Ag NPs as interconnection material has a potential application in the electronic packagingrnindustry.