A Low-Temperature Bonding Process Using Mixed Cu-Ag Nanoparticles

摘要

A low-temperature bonding process to form joints with high strength and ionic migration resistance using mixed Cu-Ag nanoparticles was studied. Although it was difficult to obtain strong joints using Cu nanoparticles, with the addition of Ag nanoparticles to the Cu nanoparticles the bonding strength of the Cu-to-Cu joints increased. The joints formed by the mixed Cu-Ag nanoparticles at 350 deg C exhibited a high bonding strength of approx50 MPa. Counterelectrodes made of the mixed Cu-Ag nanoparticles had four times higher ionic migration resistance compared with counterelectrodes made only of Ag nanoparticles.