bond structure with metal nanoparticles and bonding process with the use of metal nanoparticles

摘要

A bond structure with metal nanoparticles comprises a first element (1) with a metal surface on at least one side, and a second element (2) with a metal surface on at least one side, wherein the second element (2) is arranged in such a way that the metal surface of the second element (2) of the metal surface of the first element (1), and a bonding material (3), of which the first element (1) and the second element (2) by sinter bonding of the metal nanoparticles bondet. At least one of the metal surfaces of the first element (1) and of the second element (2) is designed in such a way that they have a rough surface with a surface roughness is within the range of 0,5 μm to 2,0 μm is.