Mixed wire bonding profile and pad-layout configurations in IC packaging processes for high-speed electronic devices

摘要

A method and apparatus for mixed wire bonding and staggered bonding pad placement. A first plurality of bonding pads is arranged on a semiconductor device. A second plurality of bonding pads is also arranged on the semiconductor device. The bonding pads of the second plurality of bonding pads are arranged in a staggered pattern, such that the first and second pluralities of bonding pads form one of a plurality of double rows of bonding pads on the semiconductor device.