首页> 外文会议>Materials science of microelectromechanical systems(MEMS) devices >Torsion testing of diffusion bonded LIGA formed nickel
【24h】

Torsion testing of diffusion bonded LIGA formed nickel

机译:扩散键合LIGA形成镍的扭转测试

获取原文
获取原文并翻译 | 示例

摘要

A test technique has been devised which is suitable for the testing of the bond strength of batch diffusion bonded LIGA or DXRL defined structures. The method uses a torsion tester constructed with the aid of LIGA fabrication and distributed torsion specimens which also make use of the high aspect ratio nature of DXRL based processing. Measurements reveal achieved bond stengths of 130 MPa between electroplated nickel with a bond temperature of 450 deg C at 7 ksi pressure which is a sufficiently low temperature to avoid mechanical strength degradation.
机译:已经设计出一种测试技术,其适合于测试批量扩散结合的LIGA或DXRL定义的结构的结合强度。该方法使用借助LIGA加工构造的扭转测试仪和分散的扭转试样,该试样还利用了基于DXRL的加工的高长宽比特性。测量表明,在7 ksi压力下,粘合温度为450摄氏度,电镀镍之间的粘合强度为130 MPa,该温度足以避免机械强度降低。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号