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Soft X-ray photoelectron spectroscopy study of Boron doped on top surfaces and sidewalls of Si Fin structures

机译:软X射线光电子能谱研究Si Fin结构的顶部和侧壁上掺杂的硼

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摘要

2D distribution of depth profiling of impurities and their activityon-activity are very important for development of process technology for nano-scale 3D devices. Si Fin structures doped with Boron (B) were evaluated by soft X-ray photoelectron spectroscopy (SXPES) and a feasibility of detecting the difference were demonstrated between the chemical bonding states as well as concentrations of B on top of Fins and those on sidewall of Fins.
机译:杂质深度分布及其活性/非活性的2D分布对于开发纳米​​级3D器件的工艺技术非常重要。通过软X射线光电子能谱(SXPES)评估了掺杂硼(B)的Si Fin结构,并证明了检测化学键合状态以及鳍顶部和侧壁侧壁上B的浓度之间差异的可行性。鳍。

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