首页> 外文会议>International Symposium on Ultra Clean Processing of Semiconductor Surfaces;UCPSS; 20060918-20;20060918-20; Antwerp(BE);Antwerp(BE) >Surface states and recombination loss on wet-chemically passivated Si studied by Surface Photovoltage (SPV) and Photoluminescence (PL)
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Surface states and recombination loss on wet-chemically passivated Si studied by Surface Photovoltage (SPV) and Photoluminescence (PL)

机译:通过表面光电压(SPV)和光致发光(PL)研究湿化学钝化Si的表面态和复合损失

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As shown here, SPV- and PL measurements can be used as a very sensitive tool, to analyse preparations-induced surface electronic properties during wet-chemical processes. Summarizing the results of our recently published investigations [4,17,19] the preparation-induced surface micro-roughness and resulting density of rechargeable states on wet-chemically H-terminated surfaces were found to be mainly influenced by two factors: firstly, the morphology of the initial silicon/oxide interface after wet-chemical oxidizing pre-treatment and, secondly the behaviour of the final etching HF- or NH_4F containing solution. It is important to apply non-aggressive oxidizing solutions under controlled conditions to avoid an increase of interface roughness during the oxidation process. Low recombination loss and densities of rechargeable states on Si(111) and Si(100) surfaces were achieved by optimisation of special sequences of wet-chemical oxidation and etching treatments, with respect to the crystallographic surface orientation.
机译:如此处所示,SPV和PL测量可用作非常敏感的工具,以分析湿化学过程中制剂引起的表面电子特性。总结我们最近发表的研究结果[4,17,19],发现制备引起的表面微观粗糙度以及在湿化学终止于H的表面上可充电态的密度主要受两个因素影响:首先,湿化学氧化预处理后初始硅/氧化物界面的形貌,其次是最终蚀刻含HF-或NH_4F的溶液的行为。重要的是在受控条件下使用非腐蚀性的氧化溶液,以避免在氧化过程中界面粗糙度的增加。通过优化湿化学氧化和蚀刻处理的特殊顺序(相对于晶体表面方向),可实现低重组损失和Si(111)和Si(100)表面可再充电态的密度。

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