首页> 外文会议>International Conference on Silicon Carbide and Related Materials; 20050918-23; Pittsburgh,PA(US) >Fabrication and Electrical Transport Properties of CVD Grown Silicon Carbide Nanowires (SiC NWs) for Field Effect Transistor
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Fabrication and Electrical Transport Properties of CVD Grown Silicon Carbide Nanowires (SiC NWs) for Field Effect Transistor

机译:用于场效应晶体管的CVD生长的碳化硅纳米线(SiC NW)的制备和电传输性能

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We demonstrate the fabrication and the electrical transport properties of single crystalline 3C silicon carbide nanowires (SiC NWs). The growth of SiC NWs was carried out in a chemical vapor deposition (CVD) furnace. Methyltrichlorosilane (MTS, CH_3SiCl_3) was chosen as a source precursor. SiC NWs had diameters of less than 100 nm and lengths of several μm. For electrical transport measurements, as-gown SiC NWs were prepared on a highly doped silicon wafer, pre-patterned by a photo-lithography process, with a 400 nm thick SiO_2 layer. Source and drain electrodes were defined by e-beam lithography (EBL). Prior to the metal deposition (Ti/Au : 40 nm/70 nm) by thermal evaporation, the native oxide on SiC NWs was removed by buffered HF. The estimated mobility of carriers is 15 cm~2/(Vs) for a source-drain voltage (V_(SD)) of 0.02 V. It is very low compared to that expected in bulk and/or thin film 3C-SiC. The electrical measurements from nanowire-based field effect transistor (FET) structures illustrate that SiC NWs are weak n-type semiconductor. We have also demonstrated a powerful technique, a standard UV photo-lithography process, for fabrication of SiC nanowires instead of using EBL process.
机译:我们演示了单晶3C碳化硅纳米线(SiC NWs)的制造和电传输性能。 SiC NW的生长在化学气相沉积(CVD)炉中进行。选择甲基三氯硅烷(MTS,CH_3SiCl_3)作为源前体。 SiC NW的直径小于100 nm,长度为几微米。为了进行电传输测量,在高掺杂硅晶片上制备了长成的SiC NW,并通过光刻工艺进行了预图案化,并形成了400 nm厚的SiO_2层。源电极和漏电极通过电子束光刻(EBL)定义。在通过热蒸发沉积金属(Ti / Au:40 nm / 70 nm)之前,通过缓冲HF去除SiC NWs上的天然氧化物。对于0.02 V的源漏电压(V_(SD)),估计的载流子迁移率为15 cm〜2 /(Vs)。与块状和/或薄膜3C-SiC相比,该迁移率非常低。来自基于纳米线的场效应晶体管(FET)结构的电学测量表明,SiC NW是弱n型半导体。我们还展示了一种强大的技术,一种标准的UV光刻工艺,用于制造SiC纳米线,而不是使用EBL工艺。

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