首页> 外文会议>International Conference on Silicon Carbide and Related Materials 2001 Pt.2 Oct 28-Nov 2, 2001 Tsukuba, Japan >Channel Engineering of Buried-Channel 4H-SiC MOSFET Based on the Mobility Model of the Oxide/4H-SiC Interface
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Channel Engineering of Buried-Channel 4H-SiC MOSFET Based on the Mobility Model of the Oxide/4H-SiC Interface

机译:基于氧化物/ 4H-SiC界面迁移模型的埋沟道4H-SiC MOSFET沟道工程

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摘要

The channel mobility in the vicinity of the silicon carbide (SiC)/oxide interface is modeled from the measured mobility of a surface channel SiC MOSFET and a buried-channel MOSFET. With this channel mobility model, channel engineering of a buried-channel SiC MOSFET has been done. In an optimized structure, a p-type layer is stacked between oxide and buried channel in order to avoid the mobility degradation due to the interface. Device simulation shows a remarkable increase of drain current in a p-type layer-stacked buried-channel (PLBC) MOSFET.
机译:根据表面沟道SiC MOSFET和掩埋沟道MOSFET的迁移率,可以对碳化硅(SiC)/氧化物界面附近的沟道迁移率进行建模。利用该沟道迁移率模型,完成了掩埋沟道SiC MOSFET的沟道工程设计。在优化的结构中,p型层堆叠在氧化物和掩埋沟道之间,以避免由于界面而导致的迁移率降低。器件仿真显示,p型层堆叠掩埋沟道(PLBC)MOSFET的漏极电流显着增加。

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