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Atomic scale flattening of gallium nitride substrate grown by Na flux method applying catalyst-referred etching

机译:通过Na助熔剂法生长的氮化镓衬底的原子平整度

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In this study, a gallium nitride (GaN) substrate produced by the Na flux method was planarized using catalyst-referred etching (CARE). To improve the removal rate, the GaN substrate was processed using CARE-assisted photoelectrochemical (PEC) reaction (PEC CARE); the removal rate was 45 nm/h. However, the shape was embossed because of subsurface scratches introduced during preprocessing. These scratches were removed when the PEC CARE process was conducted under an applied potential of 2.5 V. In addition, a smooth surface of surface roughness 0.4 nm rms was obtained. A surface with step-terrace structures on the entire substrate was subsequently obtained when the CARE process was performed using a platinum (Pt) catalyst and deionized water; in this case, the surface roughness was 0.11 nm rms and the removal rate was 5 nm/h.
机译:在这项研究中,使用催化剂参考蚀刻(CARE)将通过Na助熔剂法生产的氮化镓(GaN)基板平面化。为了提高去除速率,使用CARE辅助光电化学(PEC)反应(PEC CARE)处理GaN衬底;去除速率为45nm / h。但是,由于在预处理过程中引入了表面下的划痕,因此使形状浮雕。当在2.5 V的施加电势下进行PEC CARE工艺时,这些划痕被去除。此外,获得了表面粗糙度为0.4 nm rms的光滑表面。当使用铂(Pt)催化剂和去离子水进行CARE工艺时,随后获得了整个基板上具有阶梯状结构的表面。在这种情况下,表面粗糙度为0.11nm rms,去除速率为5nm / h。

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