首页> 外文会议>International Conference on Nanochannels, Microchannels and Minichannels; 20070618-20; Puebla(MX) >BULK MICROMACHINING OF HIGH INDEX SILICON WAFERS AND POSSIBLE APPLICATIONS IN MICROCHANNELS AND DIFFRACTIVE ELEMENTS
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BULK MICROMACHINING OF HIGH INDEX SILICON WAFERS AND POSSIBLE APPLICATIONS IN MICROCHANNELS AND DIFFRACTIVE ELEMENTS

机译:高指数硅晶片的批量微细化及其在微通道和衍射元件中的可能应用

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In this silicon bulk micromachining project we are evaluating new approaches to develop well-controlled 3-D microstructures for microfluidics and diffractive elements. Several approaches have been fabricated and reported using rectangular structures on (0 0 1) and (0 1 1) silicon wafers. In this work, n-type, 2-5 ohm-cm, two inch, 300 μm-thick, high index (1 1 3), (1 1 4), ( 5 5 12), (0 1 1) silicon wafers were used, which were produced from [1 1 2] ingots. Most micromachined structures compatible in Microsystems are fabricated on (0 0 1) and (0 1 1) wafers and rarely using high index wafers. Several sophisticated microstructures maybe fulfilled by using this kind of substrates with different crystallographic orientations. In our experimental work, the etching pattern was designed including several polygon-like structures to analyze the resulting morphology and crystallographic planes developed during a long-time etching. One of them, an array of 10 squared structures is arranged as follows: the first square is aligned parallel/perpendicular to the (0 1 1) main flat and then the next squares were slanted ranging from 5° till 45° in 5° steps. We have developed an experimental set using different KOH-H2O dilution at 60℃. All the experimental procedure was developed at the same time on (0 0 1) and (0 1 1) silicon wafers, which were used as control samples. Our etching mask containing several polygon-like structures was transferred parallel to the main (0 1 1) flat of the low and high index wafers. We are reporting the etching of several structures, watching the roughness evolution of the walls and bottom surfaces, with the main purpose of developing microstructures for microfluidics and integrated optics applications. In this way we have observed a couple of interesting structures whose very smooth walls could be used to develop a very simple fabrication procedure of blazed diffraction gratings for infrared applications.
机译:在这个大体积的硅微机械加工项目中,我们正在评估开发微流控和衍射元件可控的3-D微结构的新方法。在(0 0 1)和(0 1 1)硅晶片上使用矩形结构已经制造并报道了几种方法。在这项工作中,使用n型2-5 ohm-cm,两英寸,厚度300μm的高折射率(1 1 3),(1 1 4),(5 5 12),(0 1 1)硅晶片使用的是从[1 1 2]锭生产的。在Microsystems中兼容的大多数微机械结构都是在(0 0 1)和(0 1 1)晶片上制造的,很少使用高折射率晶片。通过使用这种具有不同晶体学取向的衬底,可以实现几种复杂的微结构。在我们的实验工作中,设计的蚀刻图案包括几个类似多边形的结构,以分析长时间蚀刻后产生的形貌和晶体学平面。其中一个是由10个正方形结构组成的阵列,其排列方式如下:第一个正方形平行于/垂直于(0 1 1)主平面对齐,然后下一个正方形以5°的步幅从5°倾斜到45° 。我们已经开发出了在60℃下使用不同KOH-H2O稀释度的实验装置。在(0 0 1)和(0 1 1)硅片上同时开发了所有实验程序,这些硅片用作对照样品。我们的包含几个多边形结构的蚀刻掩模平行于低折射率和高折射率晶片的主(0 1 1)平面转移。我们正在报道几种结构的蚀刻,观察壁和底表面的粗糙度变化,其主要目的是开发用于微流体和集成光学应用的微结构。这样,我们观察到了几个有趣的结构,它们的非常光滑的壁可用于开发非常简单的红外应用闪耀衍射光栅的制造程序。

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