首页> 外文会议>International conference on micro- and nano-electronics 2009 >OPTIMIZATION OF NEAR-SURFICIAL ANNEALING FOR DECREASING OF DEPTH OF P-N-JUNCTION IN SEMICONDUCTOR HETEROSTRUCTURE
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OPTIMIZATION OF NEAR-SURFICIAL ANNEALING FOR DECREASING OF DEPTH OF P-N-JUNCTION IN SEMICONDUCTOR HETEROSTRUCTURE

机译:减少半导体异质结构中P-N结深度的近表面退火优化

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摘要

In this paper analysis of dopant redistribution during formation of p-n-junction in semiconductor heterostructure by laser or microwave annealing has been done. It has been shown, that inhomogeneiry of the heterostructure after annealing with appropriate duration leads to simultaneously increasing of sharpness of p-n-junction and homogeneity of dopant distribution in doped area. Inhomogeneiry of temperature distribution leads to simultaneously increasing of both effects. Some conditions on properties of doped heterostructure and annealing time for simultaneously increasing of sharpness of p-n-junction and homogeneity of dopant distribution in doped area are formulated.
机译:在本文中,已经对通过激光或微波退火在半导体异质结构中形成p-n结期间的掺杂物重新分布进行了分析。已经表明,在适当持续时间的退火之后,异质结构的不均匀性导致同时增加p-n结的清晰度和掺杂区域中掺杂剂分布的均匀性。温度分布的不均匀导致两种作用同时增加。提出了同时提高p-n型结的锐度和掺杂区中掺杂剂分布均匀性的掺杂异质结构和退火时间的一些条件。

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