首页> 外文会议>Advances in Computational Methods in Sciences and Engineering 2005 vol.4B; Lecture Series on Computer and Computational Sciences; vol.4B >Parallel Simulation of Deep Sub-Micron Double-Gate Metal-Oxide-Semiconductor Field Effect Transistors
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Parallel Simulation of Deep Sub-Micron Double-Gate Metal-Oxide-Semiconductor Field Effect Transistors

机译:深亚微米双栅极金属氧化物半导体场效应晶体管的并行仿真

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摘要

Drift-Diffusion Density Gradient model (DD-DG) is the most popular model for simulating carrier transport phenomena in sub-micron semiconductor device, especially in two- or three-dimensional space. In deep sub-micron regime, the width effects cannot be neglected while simulating, i.e., three-dimensional simulation must be considered. However, three-dimensional computing is time-consuming. Fortunately, the dilemma of time consuming or rough approximation can be overcame by advanced computing technique. In this paper, we employ a parallel direct solving method to simulate double-gate metal-oxide-semiconductor field effect transistors (DG-MOSFET). The computational benchmarks of the parallel simulation, parallel speedup, load balance, and efficiency are studied in this work. Parallel numerical simulation of semiconductor devices is shown to be an indispensable tool for fast characterization and optimal design of semiconductor devices.
机译:漂移扩散密度梯度模型(DD-DG)是最流行的模型,用于模拟亚微米半导体器件(尤其是二维或三维空间)中的载流子传输现象。在深亚微米状态下,在模拟时不能忽略宽度效应,即必须考虑三维模拟。但是,三维计算非常耗时。幸运的是,高级计算技术可以克服耗时或粗略近似的难题。在本文中,我们采用并行直接求解方法来模拟双栅金属氧化物半导体场效应晶体管(DG-MOSFET)。在这项工作中研究了并行模拟,并行加速,负载平衡和效率的计算基准。半导体器件的并行数值模拟显示出是快速表征和优化半导体器件设计必不可少的工具。

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