Advanced Physical Failure Analysis Techniques Using 3D Rotation Imaging from Plane-View TEM Sample

机译：从平面TEM样品中使用3D旋转成像的高级物理故障分析技术

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来源
《International Metallographic Society Annual meeting;Microscopy Society of America Annual Meeting;Microanalysis Society Annual meeting》|2011年|634-635|共2页
会议地点 Nashville, TN(US)
作者
Hyo-Jin Kang; Jae-Gon Gwak; Tae-Su Park; Tae-Sun Back; Ho-Joung Kim; Oscar Han;
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Research and Development Division Hynix Semiconductor Inc. San 136-1 Ami-ri Bubal-eub Ichon-si Kyoungki-do 467-701 Korea;

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机译：失效技术与先进的TEM表征方法相结合的电气故障分析
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3. Failure analysis technique by extracting the TEM samples from the backside of LSI chips [J] . H. Maeda, M. Furuta, N. Hashikawa, 電子情報通信学会技術研究報告. 電子部品·材料. Component Parts and Materials . 2001,第516期

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4. Physical Failure Analysis Techniques using3D Rotation Imaging Method by STEM [C] . Tae-Sun Back, rnJong-Hyeop Kim, rnSoon-Ju Lee, ISTFA 2008 : Conference proceedings from the 34th international symposium for testing and failure analysis . 2008

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7. Advanced Physical Failure Analysis Techniques Using 3D Rotation Imaging from Plane-View TEM Sample [O] . H-J Kang, J-G Gwak, T-S Park, 2011

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Advanced Physical Failure Analysis Techniques Using 3D Rotation Imaging from Plane-View TEM Sample

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