Freescale Semiconductor, (M) Sdn. Bhd. No. 2, Jalan SS 8/2 Free Industrial Zone Sungei Way Petaling Jaya 47300rnTel: 603-78823790;
Freescale Semiconductor, (M) Sdn. Bhd.rnNo. 2, Jalan SS 8/2 Free Industrial ZonernSungei Way Petaling Jaya 47300;
Freescale Semiconductor, (M) Sdn. Bhd.rnNo. 2, Jalan SS 8/2 Free Industrial ZonernSungei Way Petaling Jaya 47300 Faculty of Engineering, Department of Electrical, Electronics System,rnNational University of Malaysiarn43600 Bangi, Selangor, MalaysiarnTel: 603-89216322 Fax: 603-89216146;
Faculty of Engineering, Department of Electrical, Electronics System,rnNational University of Malaysiarn43600 Bangi, Selangor, Malaysia;
Faculty of Engineering, Department of Electrical, Electronics System,rnNational University of Malaysiarn43600 Bangi, Selangor, Ma;
BGA packaging; lead-free C5; brittle solder joint; intermetallics; SnAgNiCo; rnSn3.8Ag0.7Cu; shear and pull strength;
机译:SAC405和SAC405 + 0.1%Al无铅焊料的比较研究
机译:无铅晶圆级芯片级封装中的Sn-4Ag-0.5Cu焊球和Sn-7Zn-AI(30 ppm)焊膏的焊点界面反应研究
机译:无铅焊点和块状焊料的等温机械疲劳性能比较
机译:SnAgNiCo和Sn3.8Ag0.7Cu C5无铅焊料体系的比较研究
机译:不同机械测试协议对无铅焊接系统可靠性的比较。
机译:用于无铅焊接的液体系统混合焓:Al–Cu–Sn系统
机译:PB免焊期焊接技术的现状及问题。无铅焊料和Sn / Pb共晶焊料的可安装性的比较。
机译:促进Nasa使用GEIa-sTD-0005-1,包含无铅焊料的航空航天和高性能电子系统的性能标准