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CLEANING COMPOSITION FOR REMOVING LEAD-FREE SOLDER FLUX AND SYSTEM FOR REMOVING LEAD-FREE SOLDER FLUX

机译:去除无铅焊剂的清洁成分和去除无铅焊剂的系统

摘要

lead-free by using the solder flux with sufficient detergency even when the washing of the obtained object to be cleaned, and also, the detergent composition can be easily separated from the pre-rinse can be, and to reduce possible pre-rinse wastewater and the method to provide a lead-free solder flux removal system used for the purpose. Certain glycol ethers (A), certain polyoxyalkylene amines (B), and (c1) an aliphatic hydroxycarboxylic acid-based chelating agent, and (C 2) (poly) at least one type chelating agent is selected from phosphoric acid-based chelating agent, the group consisting of (C) containing a lead-free solder flux is used for a detergent composition.
机译:通过使用具有足够去污力的助焊剂即使在洗涤所得的被清洗物时也可以使用无铅,而且,洗涤剂组合物可以容易地从预冲洗液中分离,并减少可能的预冲洗废水和提供用于该目的的无铅助焊剂去除系统的方法。某些二醇醚(A),某些聚氧化烯胺(B)和(c1)脂族羟基羧酸基螯合剂,以及(C 2)(聚)至少一种类型的螯合剂选自磷酸基螯合剂包含无铅助焊剂的(C)组成的组用作洗涤剂组合物。

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