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CLEANING COMPOSITION FOR REMOVING LEAD-FREE SOLDER FLUX AND SYSTEM FOR REMOVING LEAD-FREE SOLDER FLUX
CLEANING COMPOSITION FOR REMOVING LEAD-FREE SOLDER FLUX AND SYSTEM FOR REMOVING LEAD-FREE SOLDER FLUX
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机译:去除无铅焊剂的清洁成分和去除无铅焊剂的系统
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摘要
lead-free by using the solder flux with sufficient detergency even when the washing of the obtained object to be cleaned, and also, the detergent composition can be easily separated from the pre-rinse can be, and to reduce possible pre-rinse wastewater and the method to provide a lead-free solder flux removal system used for the purpose. Certain glycol ethers (A), certain polyoxyalkylene amines (B), and (c1) an aliphatic hydroxycarboxylic acid-based chelating agent, and (C 2) (poly) at least one type chelating agent is selected from phosphoric acid-based chelating agent, the group consisting of (C) containing a lead-free solder flux is used for a detergent composition.
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