Optimizing batch cleaning for removing lead-free flux residues on PCAs

摘要

Electronic assembly cleaning processes are becoming increasingly more complex because of global environmental mandates and customer-driven product performance requirements. Manufacturing strategies today require process equivalence. That is to say, if a product is made or modified in different locations or processes around the world, the result should be the same. If cleaning is a requirement, will existing electronic assembly cleaning processes meet the challenge? Innovative cleaning fluid and cleaning equipment designs provide improved functionality in both batch and continuous inline cleaning processes. The purpose of this designed experiment is to report optimized cleaning process parameters for removing lead-free flux residues on popidated circuit assemblies using innovative cleaning fluid and batch cleaning equipment designs.