Advancements in the electronics industry are continuously leading to more sophisticated, more intricate and more miniaturized circuitry. In conjunction with increasing regulations on electronics manufacturing, many changes have been made to the electronics world, and thus the circuit board manufacturing process. Lead-free, no-clean and halide-free flux formulations have introduced new cleaning obstacles, especially on ever-shrinking component sizes. In order to maintain high cleanliness standards for modern circuitry, new sophisticated cleaning chemistries are required.
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