Bare die testing and MCM probing techniques

摘要

The author discusses two important issues regarding thedevelopment and manufacture of multichip modules (MCMs). First, a methodis described which is used for testing bare chips at the full operatingfrequency and over temperature extremes. This approach utilizes amodified wafer probe system and a high-speed digital tester for at-speedperformance characterization of individual chips prior to insertion intoan MCM. The purpose is to fully assure that the device will perform asrequired once committed to the module. Second, a system is described forautomated internal probing of functioning MCMs. Again, a standard waferprobe system is adapted for this purpose. This system permitscharacterization of fully populated MCMs