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Evidence for heterojunction effects in polycrystalline Si_(1-x)Ge_x thin film transistors with Si caps

机译:具有硅盖的多晶Si_(1-x)Ge_x薄膜晶体管中异质结效应的证据

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Polycrystalline silicon-germanium (poly-Si_(1-x)Ge_x) thin film transistors (TFTs) were fabricated with and without Si interlayers (caps) to buffer the SiO_2 gate dielectric and the Si_(1-x)Ge_x channel. Both low temperature processes (<=550 deg C) compatible with glss for flat panel displays and high temperature processes were used. NMOS TFTs show dramatic peformance improvements up to moderate (5 to 10 nm) interlayer thicknesses. In contrast, PMOS TFTs show only small improvements at low interlayer thicknesses (<5 nm), after which performance declines. Computer simulations using an effective medium model for polycrystalline materials suggest that in addition to interface improvement, a pseudomorphic heterojunction is formed from the strained Si cap and unstrained poly-Si_(1-x)Ge_x channel with both conduction and valence band offsets. These offsets play a significant role in inversion layer formation.
机译:制造具有和不具有Si夹层(盖)以缓冲SiO_2栅极电介质和Si_(1-x)Ge_x沟道的多晶硅-锗(poly-Si_(1-x)Ge_x)薄膜晶体管(TFT)。与平板显示器的玻璃兼容的低温工艺(<= 550摄氏度)和高温工艺都被使用。 NMOS TFT表现出显着的性能改善,中间层厚度达到中等(5至10 nm)。相反,PMOS TFT在低层间厚度(<5 nm)下仅显示出很小的改进,此后性能下降。使用有效的多晶材料介质模型进行的计算机模拟表明,除了改进界面之外,还由应变的Si帽和未应变的具有导带和价带偏移的poly-Si_(1-x)Ge_x通道形成了伪晶异质结。这些偏移在反型层形成中起重要作用。

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