Thermal-Mechanical Failure and Life Analysis on CBGA Package used for Great Scale FPGA Chip

摘要

CBGA (Ceramic Ball Grid Array) is one kind of advanced package for FPGA, which can fulfill the demands of high interconnect density, high thermal and electronic performance, high chip-assembling yields, high reliability. But in multiple loading environments, CBGA has the invalidation mode of solder joint thermal-mechanical failure, which will influence the long term reliability of FPGA circuits. But there is few research on the China native made CBGA package. In this paper research of finite element analysis and solder joint fatigue predictive equation have been made on some of CBGA packages, and some failure prediction and ATC test results have been given.