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60-nm Gate Length SOI CMOS Technology Optimized for 'System-on-a-SOI-Chip' Solution

机译:针对“ SOI芯片系统”解决方案而优化的60纳米栅极长度SOI CMOS技术

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摘要

In this paper, we describe 60-nm gate length SOI CMOS technology for "system-on-a-SOI-chip" solution. This concept features that: 1) high speed logic circuits are designed with PDSOI in order to enhance operation speed, 2) the remaining circuits which require stable body potential are designed with body-slightly-tied SOI (BSTSOI~(TM)), in which body potential is fixed with no area penalty. With newly developed self-aligned dual trench isolation (SDTI), both PDSOI and BSTSOI can be fabricated on the same die. We compare PDSOI and BSTSOI with bulk CMOS devices in terms of transistor characteristics and circuit performance including SRAM static noise margin as well as soft error immunity, In addition, we demonstrate stacked metal-insulator-metal (MIM) capacitor DRAM cell fabricated on BSTSOI.
机译:在本文中,我们描述了用于“系统级SOI芯片”解决方案的60 nm栅长SOI CMOS技术。这个概念的特点是:1)用PDSOI设计高速逻辑电路,以提高运行速度; 2)其余需要稳定体电位的电路,采用体微绑SOI(BSTSOI〜)设计,哪个体势固定,没有面积损失。借助新开发的自对准双沟槽隔离(SDTI),PDSOI和BSTSOI均可在同一芯片上制造。我们将PDSOI和BSTSOI与大容量CMOS器件的晶体管特性和电路性能(包括SRAM静态噪声容限和软错误抗扰性)进行了比较。此外,我们演示了在BSTSOI上制造的堆叠式金属-绝缘体-金属(MIM)电容器DRAM单元。

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