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SITE-SELECTIVE METAL PATTERNING/METAL-ASSISTED CHEMICAL ETCHING ON GaAs SUBSTRATE THROUGH COLLOIDAL CRYSTAL TEMPLATING

机译:通过胶体晶体模板在GaAs衬底上进行选择性金属图案化/金属辅助化学蚀刻

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Systematic research on an n-GaAs substrate through a combination of colloidal crystal templating, electroless plating/two-step catalyzation and subsequent metal-assisted chemical etching was carried out. Using self-organized polystyrene spheres as a mask, metal particles, i.e., Cu, Ag and Pd, were selectively deposited at sites resulting in the formation of metal honeycomb patterns on GaAs. Ordered GaAs convex arrays were fabricated by the chemical etching of GaAs originating from the honeycomb-patterned Ag and Pd metals, which acted as etching catalysts, whereas the effectiveness of Cu as a catalyst in metal-assisted etching was not confirmed. Each metal catalyst resulted in the formation of a characteristic etched structure and etching depth, and thus, etching rate. In addition, different anisotropic etching structures were obtained by Ag-assisted etching for (100)- and (111)-oriented substrates. The crystal-face orientation as well as the metal used affects the rate of metal-assisted chemical etching and the morphology obtained.
机译:通过结合胶体晶体模板,化学镀/两步催化以及随后的金属辅助化学蚀刻,对n-GaAs衬底进行了系统研究。使用自组织的聚苯乙烯球作为掩膜,将金属颗粒,即Cu,Ag和Pd选择性沉积在位点上,从而在GaAs上形成金属蜂窝状图案。通过化学蚀刻源自蜂窝图案化的Ag和Pd金属的GaAs制备了有序的GaAs凸阵列,它们起着蚀刻催化剂的作用,但尚未确认Cu在金属辅助蚀刻中作为催化剂的有效性。每种金属催化剂导致形成特征性的蚀刻结构和蚀刻深度,并因此导致蚀刻速率。另外,通过Ag辅助蚀刻对(100)和(111)取向的衬底获得了不同的各向异性蚀刻结构。晶面取向以及所使用的金属会影响金属辅助化学蚀刻的速率和所获得的形态。

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