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Preparation of PZT Films Derived by Hybrid Processing for MEMS Application

机译:混合工艺制备的PZT薄膜在MEMS中的应用

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Pb(Zr_(0.52)Ti_(0.48))O_3 (PZT) thin films were prepared on Pt/Ti/SiO_2/Si substrates by hybrid processing: sol-gel method and pulsed laser deposition. The temperature of postdeposition annealing in hybrid processing is 650℃, and is lower than that in the case of direct film deposition by pulsed laser deposition on a Pt/Ti/SiO_2/Si substrate. The preferred orientation of the PZT films obtained by hybrid processing can be controlled using the seed layer obtained by the sol-gel process. The TEM image showed that the PZT films have a polycrystalline columnar microstructure extending throughout the thickness of the film and no sharp interface was observed between the layers obtained by the sol-gel method and the pulsed laser deposition process. Electrical properties of the films were evaluated by measuring their P-E hysteresis loops and dielectric constants. The 1-μm-thick PZT films fabricated by hybrid processing consist of mainly the perovskite phase with a (111)-preferred orientation and have good ferroelectric properties. The ferroelectric parameters were remanent polarization P_r = 23.6 μC,/cm~2, and coercive field E_c. = 54.8 kV/cm.
机译:通过混合工艺:溶胶-凝胶法和脉冲激光沉积在Pt / Ti / SiO_2 / Si衬底上制备了Pb(Zr_(0.52)Ti_(0.48))O_3(PZT)薄膜。混合工艺中的沉积后退火温度为650℃,低于在Pt / Ti / SiO_2 / Si衬底上通过脉冲激光沉积直接成膜的情况。通过杂化处理获得的PZT膜的优选取向可以使用通过溶胶-凝胶法获得的种子层来控制。 TEM图像显示,PZT膜具有在膜的整个厚度上延伸的多晶柱状微结构,并且在通过溶胶-凝胶法和脉冲激光沉积法获得的层之间没有观察到清晰的界面。通过测量膜的P-E磁滞回线和介电常数来评估膜的电性能。通过混合工艺制备的厚度为1μm的PZT薄膜主要由具有(111)优先取向的钙钛矿相组成,并具有良好的铁电性能。铁电参数为剩余极化强度P_r = 23.6μC,/ cm〜2,矫顽场E_c。 = 54.8 kV / cm。

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