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Operation and performance of the CNSE Vistec VB300 electron beam lithography system

机译:CNSE Vistec VB300电子束光刻系统的操作和性能

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At the end of 2008, the College of Nanoscale Science and Engineering (CNSE) formally accepted a Vistec VB300 Gaussian electron beam lithography system. The system is a key component of the overall lithography strategy of the College and complements existing state of the art tooling for 193nm immersion, Extreme Ultra Violet and nanoimprint. The demonstrated resolving power of the system easily exceeds that of the facility's optical scanners. Together with 300mm wafer compatibility, and a class 1 mini environment, the system is well poised to execute its primary mission of supporting a variety of programs in post CMOS device integration. For a 300mm tool to be able to exchange wafers with other tooling in a full flow line it is necessary to pass stringent backside metal contamination testing. TXRF (total reflection x-ray fluorescence) testing performed with 300mm wafers on the VB300 satisfied the permitted metal contamination levels and cleared the way for introduction of ebeam patterned wafers into the process flow. Most of the tooling in the 300mm line handles wafers in front opening universal pods (FOUPS). With the relatively low throughput of the system (hours per wafer, not wafers per hour), this type of interface is not required. In order to maintain a low level of defects, 300mm wafers are removed from the FOUPS in the class 1 mini environment and loaded into the system.rnIn addition to the 300mm capability, the system supports a wide range of wafer sizes, photomasks and piece parts. This enables the platform to support the 200mm activities at the College as well as the small samples frequently encountered with novel materials that have no support tooling available for 200mm and 300mm wafer sizes.rnThe VB300 platform readily met the Vistec standard acceptance test specifications. The paper presents details of the acceptance test together with examples of additional work in progress that includes implementation of rigorous tool monitor standards, imprint template fabrication and mix and match overlay between the VB300 and optical patterning tools.
机译:2008年底,纳米科学与工程学院(CNSE)正式接受了Vistec VB300高斯电子束光刻系统。该系统是学院整体光刻策略的关键组成部分,是对193nm浸没,Extreme Ultra Violet和纳米压印的现有最先进工具的补充。所展示的系统分辨能力很容易超过该设施的光学扫描仪。加上300mm晶圆兼容能力和1类微型环境,该系统已准备就绪,可以执行其主要任务,以支持后CMOS器件集成中的各种程序。为了使300mm的工具能够在完整的流水线中与其他工具交换晶圆,必须通过严格的背面金属污染测试。在VB300上对300mm晶圆进行的TXRF(全反射X射线荧光)测试满足了允许的金属污染水平,并为将电子束图案化的晶圆引入工艺流程扫清了道路。 300毫米生产线中的大多数工具都可以处理前开口通用盒(FOUPS)中的晶圆。由于系统的吞吐量相对较低(每个晶片数小时,而不是每小时晶片数),因此不需要此类接口。为了保持低水平的缺陷,在1类微型环境中从FOUPS中取出了300mm的晶片,并将其装入系统。rn除了300mm的能力外,该系统还支持各种晶片尺寸,光掩模和零件。这使该平台能够支持学院的200mm活动以及使用新型材料经常遇到的小样本,而这些新型材料没有适用于200mm和300mm晶圆尺寸的支持工具。rnVB300平台轻松满足了Vistec标准验收测试规范。本文介绍了验收测试的详细信息,以及正在进行的其他工作的示例,其中包括实施严格的工具监控器标准,压印模板制作以及VB300和光学图案形成工具之间的混合匹配覆盖。

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