首页> 外文会议>8th World Multi-Conference on Systemics, Cybernetics and Informatics(SCI 2004) vol.8: Control, Communication and Network Systems, Technologies and Applications >Fabrication and Characteristics of Pyroelectric Infrared Sensors using P(VDF/TrFE) Thick Film for Human Body Detecting
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Fabrication and Characteristics of Pyroelectric Infrared Sensors using P(VDF/TrFE) Thick Film for Human Body Detecting

机译:P(VDF / TrFE)厚膜用于人体检测的热释电红外传感器的制备和特性

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Pyroelectric infrared sensors have been fabricated using poled P(VDF/TrFE) film. The weight percent and thickness of the poled P(VDF/TrFE) film are 75/25 percent and 25 μm respectively. When infrared absorbed, the P(VDF/TrFE) film expands with increasing temperature. This results in a detectable deformation and corresponding charge generation. The reverse effect occurs on cooling of the film. So the film should be sink thermal energy through sensor quickly for high responsibility, fast response time and low NEP (Noise Equivalent Power) Fast thermal energy sink of the sensor is important for sensors better performance. For this self supporting free standing structure that using no substrate to reduce the thickness of the sensor for fast thermal energy sink. Because melting point of P(VDF/TrFE) film is quite low, an aluminum top and bottom electrode deposited carefully to avoid short circuit during thermal evaporation. The device mounted in a TO-5 housing with silicon window to filter infrared light of 5.5 ~ 14 μm wavelength for human body detecting. The responsibility, NEP and specific detectivity D~* of device were 9.62 x 10~5 V/W, 3.95 x 10~(-7) W and 5.06 x 10~5 cm/W under emission energy of 13 μW/cm~2 respectively.
机译:热释电红外传感器已使用极化P(VDF / TrFE)膜制成。极化P(VDF / TrFE)膜的重量百分比和厚度分别为75/25%和25μm。当吸收红外线时,P(VDF / TrFE)膜会随着温度的升高而膨胀。这导致可检测的变形和相应的电荷产生。相反的效果发生在膜的冷却上。因此,薄膜应迅速通过传感器吸收热能,以实现较高的责任感,更快的响应时间和较低的NEP(噪声等效功率)传感器的快速热能吸收对于传感器更好的性能至关重要。对于这种自支撑的独立式结构,该结构不使用任何基板来减小传感​​器的厚度,从而实现快速散热。由于P(VDF / TrFE)膜的熔点很低,因此铝的顶部和底部电极应小心沉积,以免在热蒸发过程中发生短路。该设备安装在带有硅窗的TO-5外壳中,可以过滤5.5〜14μm波长的红外光以进行人体检测。在13μW/ cm〜2的发射能量下,设备的责任,NEP和比探测比D〜*为9.62 x 10〜5 V / W,3.95 x 10〜(-7)W和5.06 x 10〜5 cm / W分别。

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