Solder Joint Fatigue Life Prediction of Electronic Packages Using Combined FEA and Peridynamics

摘要

A new analysis method for solder joint fatigue life prediction is introduced. The method utilizes a combination of finite element method (FEM) and peridynamic (PD) theory. The thermal cycle simulation is performed using FEM to obtain deformation field, which is imposed as boundary conditions to the PD model. Fatigue crack initiation and its progression is captured in PD simulations. The approach is demonstrated on five packages. Qualitative and quantitative results of the PD analyses are shown. The life predictions based on FEM for all packages as well as predictions using PD on two packages are presented.