SOLDER JOINT PART LIFE PREDICTION METHOD, SOLDER JOINT PART LIFE PREDICTION DEVICE, AND ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a solder joint part life prediction method, life prediction device, and electronic apparatus for highly accurately evaluating the life of each solder joint part in consideration of rigidity deterioration to occur in each joint part by the progress of damage.SOLUTION: A solder joint part life prediction method includes: a step for referring to temperature history information of a measured object having solder joint parts; a step for checking at least one of the physical amounts of the amplitude of a temperature fluctuation, the number of cycles, average temperature, and a period by cycle counting based on the temperature history information; a step for calculating a distortion range, based on at least one of the physical amounts checked by the cycle counting by using a previously generated response surface; and a step for calculating a distortion range increase rate with referring to a previously obtained damage value and a distortion fluctuation history in the distortion range, based on the distortion range.