Institute of Microelectronics, Peking University, Beijing, 100871, China;
Institute of Microelectronics, Peking University, Beijing, 100871, China;
Institute of Microelectronics, Peking University, Beijing, 100871, China;
Institute of Microelectronics, Peking University, Beijing, 100871, China;
Institute of Microelectronics, Peking University, Beijing, 100871, China;
Institute of Microelectronics, Peking University, Beijing, 100871, China;
Human computer interaction; Integrated circuit reliability; Integrated circuit modeling; Degradation; Random access memory; Stress;
机译:自热引起的可变性和可靠性的统计模拟及其在基于Nanosheet-FET的SRAM中的应用
机译:基于SRAM的纳米晶圆制自加热诱导可变性和可靠性的统计模拟
机译:统计可变性和可靠性以及对14nm节点SOI FinFET技术的相应6T-SRAM单元设计的影响
机译:基于SRAM的纳米片 - FET的自加热诱导变异性和可靠性
机译:基于负载测试的基础设计的现场内部变异性和可靠性
机译:tDCS引起下肢运动皮层变化的可靠性和变异性
机译:基于可变性感知设计优化的铁电影SRAM的可行性研究