Research Center for Ubiquitous MEMS and Micro Engineering (UMEMSSME), National Institute of Advanced Industrial Science and Technology (AIST), 1-2-1 Namiki, Tsukuba, Ibaraki 305-8564, Japan;
Research Center for Ubiquitous MEMS and Micro Engineering (UMEMSSME), National Institute of Advanced Industrial Science and Technology (AIST), 1-2-1 Namiki, Tsukuba, Ibaraki 305-8564, Japan;
Research Center for Ubiquitous MEMS and Micro Engineering (UMEMSSME), National Institute of Advanced Industrial Science and Technology (AIST), 1-2-1 Namiki, Tsukuba, Ibaraki 305-8564, Japan;
Gold; Rough surfaces; Surface roughness; Bonding; Surface treatment; Atomic layer deposition; Silicon;
机译:在电镀图案上直接转移原子光滑的金膜在大气中的室温金-金结合
机译:通过剥离工艺和大气中的室温Au-Au键将原子光滑的表面形状复制到电镀Au图案上
机译:在大气中使用Au / Au原子扩散键合进行单晶金刚石和Si的室温键合
机译:将原子平滑Au膜直接转移到大气空气中的室温Au-Au键合的电镀图案上
机译:二嵌段共聚物薄膜中定向自组装方法的数值模拟,用于高范围阶的纳米级图案的高效制造
机译:金膜厚度和表面粗糙度对室温晶圆键合和金-金表面活化键合的晶圆级真空密封的影响
机译:使用表面活性粘合法在环境空气中具有光滑Au薄膜的晶片室温粘合
机译:au-sn和au-au内部铅键的失效研究