Key Laboratory of Silicon Device and Technology, Chinese Academy of Sciences, Institute of Microelectronics of Chinese Academy of Sciences, Beijing, China;
Key Laboratory of Silicon Device and Technology, Chinese Academy of Sciences, Institute of Microelectronics of Chinese Academy of Sciences, Beijing, China;
Key Laboratory of Silicon Device and Technology, Chinese Academy of Sciences, Institute of Microelectronics of Chinese Academy of Sciences, Beijing, China;
Key Laboratory of Silicon Device and Technology, Chinese Academy of Sciences, Institute of Microelectronics of Chinese Academy of Sciences, Beijing, China;
Key Laboratory of Silicon Device and Technology, Chinese Academy of Sciences, Institute of Microelectronics of Chinese Academy of Sciences, Beijing, China;
Key Laboratory of Silicon Device and Technology, Chinese Academy of Sciences, Institute of Microelectronics of Chinese Academy of Sciences, Beijing, China;
Key Laboratory of Silicon Device and Technology, Chinese Academy of Sciences, Institute of Microelectronics of Chinese Academy of Sciences, Beijing, China;
Key Laboratory of Silicon Device and Technology, Chinese Academy of Sciences, Institute of Microelectronics of Chinese Academy of Sciences, Beijing, China;
Reliability; Physics; Failure analysis; Thermal resistance; Electrodes; Bonding;
机译:31世纪欧洲电子设备可靠性研讨会(ESREF 2020)编辑
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机译:使用基于物理的设备级模型在数字电路中进行可靠性分析的可扩展方法。
机译:稳定性极限测试的有效性和可靠性:2种姿势稳定性评估装置的比较
机译:基于故障物理的可靠性仿真分析在航电设备中的应用Application of Reliability Simulation Based on Failure Physic in Avionics Device
机译:EsREF 98 - 第9届欧洲电子器件可靠性,失效物理和分析研讨会