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Conduction-type dependence of thermal oxidation rate on SiC(0001)

机译:热氧化速率对SiC(0001)的导电类型依赖性

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The conduction-type dependent thermal oxidation rate in SiC was discovered. The oxidation was performed for SiC(0001) with nitrogen doping (n-type) in the range from 2.0×1016 cm−3 to 1.0×1019 cm−3, and aluminum doping (p-type) in the range from 2.0×1015 cm−3 to 1.0×1019 cm−3, exhibiting a clear dependence. For n-type SiC the oxide thickness increases for higher doping density, and for p-type the thickness decreases. Note that in the case of Si oxidation, there exists very little difference of oxidation rate between the conduction types in such low doping density, and the dependence is peculiar to SiC. The authors speculate the difference originates from the difference in carrier (electron/hole) density during the oxidation, which can reasonably explain the difference in the oxidation rate between Si and SiC.
机译:发现了SiC中依赖于导电类型的热氧化速率。对SiC(0001)进行氧化,氮掺杂量(n型)在2.0×1016 cm-3至1.0×1019 cm-3之间,铝掺杂量(p型)在2.0×1015之间cm-3到1.0×1019 cm-3,表现出明显的依赖性。对于n型SiC,氧化物厚度增加以得到更高的掺杂密度,而对于p型,厚度减小。注意,在Si氧化的情况下,在这种低掺杂密度下,导电类型之间的氧化速率差异很小,并且其依赖性是SiC所特有的。作者推测,这种差异源自氧化过程中载流子(电子/空穴)密度的差异,这可以合理地解释Si和SiC之间的氧化速率差异。

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